Package and light-emitting device

ABSTRACT

A package includes a resin molded body having a side wall provided between a first side and a second side to surround a recess portion which has a bottom portion on the second side. The bottom portion of the recess portion includes an element mount region provided in a vicinity of the side wall and a wire connection region separated from the element mount region. The element mount region has a polygonal outer peripheral shape having corners and diagonals connecting two of the corners when viewed in the height direction. An area of the wire connection region is smaller than an area of the element mount region when viewed in the height direction. The wire connection region is provided on an extension of one of the diagonals passing through one of the corners of the element mount region to face toward the adjacent to one of the corners.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional application of the U.S. patentapplication Ser. No. 14/845,270 filed on Sep. 4, 2015, which claimspriority under 35 U. S. C. § 119 to Japanese Patent Application No.2014-180087, filed Sep. 4, 2014. The contents of these applications areincorporated herein by reference in their entirety.

BACKGROUND Technical Field

The present disclosure relates to a package and a light-emitting device.

Discussion of the Background

Conventionally, as a package for a light-emitting diode (LED), forexample, package structures described in Japanese Unexamined PatentApplication Publications No. 2010-153861 and No. 2006-324317 have beensuggested.

SUMMARY OF THE INVENTION

According to one aspect of the present invention, a package includes aresin molded body, a first lead electrode, and a second lead electrode.The resin molded body has a first side, a second side opposite to thefirst side in a height direction of the resin molded body, and a sidewall provided between the first side and the second side to surround arecess portion which has a bottom portion on the second side and anopening on the first side and in which a light-emitting element is to beprovided. The first lead electrode is provided on the second side of theresin molded body. The second lead electrode is provided on the secondside of the resin molded body. The bottom portion of the recess portionincludes an element mount region and a wire connection region. An uppersurface of the first lead electrode is exposed from the resin moldedbody in the element mount region and the element mount region has apolygonal outer peripheral shape having corners and diagonals connectingtwo of the corners when viewed in the height direction. The elementmount region is provided in a vicinity of the side wall. An uppersurface of the second lead electrode is exposed from the resin moldedbody in the wire connection region. The wire connection region isseparated from the element mount region. An area of the wire connectionregion is smaller than an area of the element mount region when viewedin the height direction. The wire connection region is provided on anextension of one of the diagonals passing through one of the corners ofthe element mount region to face toward the adjacent to one of thecorners.

According to another aspect of the present invention, a light-emittingdevice includes the package, the light-emitting element. Thelight-emitting element is mounted on the element mount region in therecess portion.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention and many of the attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings, wherein:

FIG. 1A illustrates a schematic perspective view of a package accordingto an embodiment of the present invention;

FIG. 1B illustrates a schematic top view of a light-emitting deviceaccording to an embodiment of the present invention;

FIG. 1C is a schematic cross-sectional view illustrating a cross-sectionthat is taken along a line A-A in FIG. 1B;

FIG. 2A illustrates a schematic top view of a light-emitting deviceaccording to an embodiment of the present invention; and

FIG. 2B is a schematic cross-sectional view illustrating a cross-sectionthat is taken along a line B-B in FIG. 2A.

DESCRIPTION OF THE EMBODIMENTS

The embodiments will now be described with reference to the accompanyingdrawings, wherein like reference numerals designate corresponding oridentical elements throughout the various drawings.

Hereinafter, embodiments of the invention will be described withreference to the drawings as appropriate. However, the package and thelight-emitting device described below are for embodying the technicalidea of the present disclosure, and unless otherwise noted, the presentinvention is not limited to the below description. In addition, thedescription in an embodiment and an example can be applied to otherembodiments and examples. Further, sizes, positional relationships andthe like of the members illustrated in each of the drawings may beexaggerated for clearer explanation.

First Embodiment

FIG. 1A illustrates a schematic perspective view of a package accordingto a first embodiment. FIG. 1B illustrates a schematic top view of alight-emitting device according to the first embodiment, and FIG. 1C isa schematic cross-sectional view illustrating a cross-section that istaken along a line A-A in FIG. 1B.

As shown in FIG. 1A, a package 100 according to the first embodiment isa package for an LED whose outer shape is a foursquare in top view. Thepackage 100 includes a first lead electrode 10, a second lead electrode20 and a resin molded body 30. The resin molded body 30 is moldedintegrally with the first lead electrode 10 and the second leadelectrode 20. The package 100 has a recess portion 110 in which alight-emitting element is stored.

The recess portion 110 is constituted by a bottom portion 111 and a sidewall 119. The bottom portion 111 includes an element mount region 113and a wire connection region (a first wire connection region) 117. Theelement mount region 113 is a region where an upper surface of the firstlead electrode 10 is exposed from the resin molded body 30. The wireconnection region 117 is a region where an upper surface of the secondlead electrode 20 is exposed from the resin molded body 30. The elementmount region 113 has a top-view shape which is substantially along anouter shape of the light-emitting element. The wire connection region117 is adjacent to the element mount region 113, and is smaller than theelement mount region 113. Further, a surface of the side wall 119 isinclined so that an opening diameter of the recess portion 110 maybecome larger toward an upward direction from the element mount region113 and the wire connection region 117.

According to the package 100 having such a structure, in which an end ofthe side wall 119 (that is, a boundary of the side wall 119 with thebottom portion 111) is provided closely to the light-emitting element tobe mounted, light emitted from the light-emitting element can bereflected by a surface of the side wall 119 directly so as to bedeflected toward the opening of the recess portion 110 easily. Thus, therepeated light reflection by inner surfaces of the package 100 can besuppressed, so that the light from the light-emitting element can beextracted efficiently.

As shown in FIGS. 1B and 1C, a light-emitting device 150 according tothe first embodiment includes the package 100, a light-emitting element40, a wire 50 and a sealing member 60. The light-emitting element 40 ismounted on the element mount region 113 of the package 100. The wire 50connects the wire connection region 117 of the package 100 and thelight-emitting element 40. The recess portion 110 of the package 100 isfilled with the sealing member 60, by which the light-emitting element40 is sealed.

In other words, the package 100 includes: the resin molded body 30having a first side and a second side opposite to the first side in aheight direction (a thickness direction) of the resin molded body 30;the first lead electrode 10 provided on the second side of the resinmolded body 30; the second lead electrode 20 provided on the second sideof the resin molded body 30; and the recess portion 110 which isprovided on the first side of the resin molded body 30 and in which thelight-emitting element 40 is provided. The recess portion 110 includes abottom portion, a top portion, and the side wall 119. The bottom portionincludes: the element mount region 113 in which an upper surface of thefirst lead electrode 10 is exposed from the resin molded body 30 andwhich has an outer peripheral shape (a top-view shape) in accordancewith an outer peripheral shape (an outer shape) of the light-emittingelement 40 when viewed in the height direction; and the wire connectionregion 117 in which an upper surface of the second lead electrode 20 isexposed from the resin molded body 30, the wire connection region 117being provided adjacent to the element mount region 113 and beingsmaller than the element mount region 113. The top portion is providedopposite to the bottom portion in the height direction. The side wall119 is provided to connect the top portion and the bottom portion sothat an area of a cross-section of the recess portion 110 with respectto the height direction decreases from the top portion to the bottomportion.

The light-emitting device 150 having such a structure can exert theabove-described function of the package 100, so that the light from thelight-emitting element 40 can be extracted efficiently.

Hereinafter, embodiments of the package 100 and the light-emittingdevice 150 will be described in detail.

As shown in FIGS. 1A to 1C, the element mount region 113 and the wireconnection region 117 preferably constitute one consecutive planarregion. Thereby, generation of burr can be suppressed while the resinmolded body 30 is molded, so that the element mount region 113 and thewire connection region 117 can be easily formed with high shapeaccuracy. Further, the wire 50 can be connected to the wire connectionregion 117 easily.

As shown in FIGS. 1A and 1B, the top-view shape of the element mountregion 113 is a round-cornered foursquare. Since many of thelight-emitting elements are rectangular in top view, the top-view shapeof the element mount region 113 is preferably a rectangle or around-cornered rectangle. Thereby, the end of the side wall 119 can beprovided closely to the light-emitting element 40 easily, and the lightemitted from the light-emitting element 40 is likely to be reflecteddirectly by the surface of the side wall 119. Incidentally, the sides ofelement mount region 113 is substantially parallel with the sides of anouter shape of the resin molded body 30 and the sides of the opening ofthe recess portion 110 in top view.

As shown in FIGS. 1A and 1B, the wire connection region 117 ispreferably positioned so that a side thereof constituting its peripheryand a side of the element mount region 113 constituting its peripherymay be on substantially the same straight line in top view. Thereby, inthe light of the molding of the resin molded body 30, the element mountregion 113 and the wire connection region 117 can be formed easily.Moreover, in case where at least one of a pair of positive and negativeelectrodes (pad electrodes) is arranged near the corner of thelight-emitting element 40 which is rectangular in top view, the wire 50can be formed easily in accordance with such arrangement.

As shown in FIGS. 1A and 1B, a shape of the opening of the recessportion 110 is a round-cornered rectangle which is substantially alongthe outer shape of the resin molded body 30 in top view. In case whereouter shape of the package is rectangular in top view, the shape of theopening of the recess portion 110 is preferably a rectangle or around-cornered rectangle, which is substantially along the outer shapeof the resin molded body 30 in top view. Thereby, the opening of therecess portion 110 can be easily provided to be large, and the lightemitted from the light-emitting element 40 can be easily extractedefficiently. Incidentally, a notch for polarity identification (see aleft lower part of the package in FIG. 1B) is not considered as theshape of the opening of the recess portion 110.

As shown in FIGS. 1A and 1B, an area of the element mount region 113 is1.67 times of an area of the light-emitting element 40 (a length of theside of the element mount region 113 is about 1.3 times of a length of aside of the light-emitting element 40) in designed value (in top view).As described above, the area of the element mount region 113 ispreferably twice or less, more preferably 1.5 times or less, and stillmore preferably 1.2 times or less of the area of the light-emittingelement 40. If the element mount region 113 has such a size, the end ofthe side wall 119 can be easily provided closely to the light-emittingelement 40, and the light emitted from the light-emitting element 40 islikely to be reflected by the surface of the side wall 119 directly. Alower limit of the area of the element mount region 113 is not limitedparticularly as long as the light-emitting element 40 can be fixed onthe element mount region 113, but is preferably larger than (one timeof) the area of the light-emitting element 40. Further, an adhesive forsticking the light-emitting element 40 is preferably spaced from theside wall 119, but may coat a part of the surface of the side wall 119,if the adhesive is translucent.

As shown in FIGS. 1A and 1C, an inclination angle θ of the surface ofthe side wall 119 (the inclination angle θ is assumed to be an angleinside the resin molded body 30 with respect to the upper surface of thelead electrode) varies depending on a structure (a shape and anarrangement) of the bottom portion 111. Thus, the surface of the sidewall 119 is constituted by plural surfaces. The some inclination anglesθ of the plural surfaces of the side wall 119 are respectivelydifferent. The inclination angle θ of the surface of the side wall 119is not limited particularly, but in the light of the light extractionefficiency, a smaller angle is more preferable as long as apredetermined depth of the recess portion 110 can be secured. Morespecifically, the inclination angle θ is, for example, more than 0° and45° or less, preferably 5° or more and 40° or less, and more preferably5° or more and 35° or less. Incidentally, in the case where the surfaceof the side wall 119 is curved as that of a below-described secondembodiment, the inclination angle θ is assumed to be considered using atangent plane of the surface or a tangent line of a cross section of theside wall 119.

As shown in FIG. 1C, the sealing member 60 preferably does not containphosphor substantially. Thereby, the surface of the side wall 119 can beutilized most efficiently as the reflection surface without being coatedwith phosphor, and the light emitted from the light-emitting element 40is likely to be reflected by the surface of the side wall 119 directly.

As shown in FIG. 1B, the package 100 may be provided with a protectiveelement 70. This protective element 70 is embedded in the resin moldedbody 30, more specifically, in the resin molded body 30 that structuresthe side wall 119. Thereby, the light incidence into the protectiveelement 70 and light absorption caused by the light incidence can besuppressed or prevented. In the package 100, the inclination angle θ ofthe surface of the side wall 119 is comparatively small, and thereby, anoccupancy ratio of surface area of the side wall 119 in the recessportion 110 is comparatively high, so that the protective element 70 canbe easily embedded in the resin molded body 30.

Incidentally, as shown in FIGS. 1A and 1B, in the package 100, thebottom portion 111 includes a second wire connection region 115. Thesecond wire connection region 115 is a region where the upper surface ofthe first lead electrode 10 is exposed from the resin molded body 30,the region being different from the element mount region 113. That is,the bottom portion 111 of the package 100 includes: the element mountregion 113; the first wire connection region 117; a spaced regionbetween the first lead electrode 10 and the second lead electrode 20;and the second wire connection region 115. Further, in the presentembodiment, these regions are consecutive so as to constitute one planarregion. The second wire connection region 115 is preferably positionedsubstantially symmetrical to the first wire connection region 117 withrespect to the element mount region 113, for example.

In addition, the description of “is smaller than the element mountregion 113” regarding the wire connection region 117 (the second wireconnection region 115 is also the same) means that the area thereof issmaller than the area of the element mount region 113 in top view, andits degree is not limited particularly. However, in the case where adirection in which the first lead electrode 10 and the second leadelectrode 20 are arranged is assumed as a lateral direction, and adirection that is perpendicular to the lateral direction is assumed as avertical direction in top view, a length (a width) of the wireconnection region 117 at least in the vertical direction is preferablyless than that of the element mount region 113. Further, it is morepreferable that a length (a width) of the wire connection region 117 inthe lateral direction is also less than that of the element mount region113.

Second Embodiment

FIG. 2A illustrates a schematic top view of a light-emitting deviceaccording to the second embodiment, and FIG. 2B is a schematiccross-sectional view illustrating a cross-section that is taken along aline B-B in FIG. 2A.

As shown in FIGS. 2A and 2B, a package 200 according to the secondembodiment is a package for an LED whose outer shape is a rectangle thatis longer in the lateral direction in top view. The package 200 includesa first lead electrode 10, a second lead electrode 20 and a resin moldedbody 30. The resin molded body 30 is molded integrally with the firstlead electrode 10 and the second lead electrode 20. The package 200 hasa recess portion 210 in which a light-emitting element is stored. Therecess portion 210 is constituted by a bottom portion 211 and a sidewall 219. The bottom portion 211 includes an element mount region 213and a wire connection region 217. The element mount region 213 is aregion where an upper surface of the first lead electrode 10 is exposedfrom the resin molded body 30. The wire connection region 217 is aregion where an upper surface of the second lead electrode 20 is exposedfrom the resin molded body 30. The element mount region 213 has atop-view shape which is substantially along an outer shape of thelight-emitting element (a foursquare in the present example). The wireconnection region 217 is adjacent to the element mount region 213, andis smaller than the element mount region 213. Further, a surface of theside wall 219 is curved so that an opening diameter of the recessportion 210 may become larger toward an upward direction from theelement mount region 213 and the wire connection region 217.

A light-emitting device 250 according to the second embodiment includesthe package 200, a light-emitting element 41, a wire 50 and a sealingmember 60. The light-emitting element 41 is mounted on the element mountregion 213 of the package 200. The wire 50 connects the wire connectionregion 217 of the package 200 and the light-emitting element 41. Therecess portion 210 of the package 200 is filled with the sealing member60, by which the light-emitting element 41 is sealed.

The package 200 and the light-emitting device 250 having such structurescan also suppress the repeated light reflection by inner surfaces of thepackage 200, so that the light from the light-emitting element 41 can beextracted efficiently.

Hereinafter, embodiments of the package 200 and the light-emittingdevice 250 will be described.

As shown in FIGS. 2A and 2B, the element mount region 213 and the wireconnection region 217 are preferably separated by a protrusion of theresin molded body 30. Thereby, the light emitted from the light-emittingelement 41 can be reflected by this protrusion of the resin molded body30, so that light incidence into the wire 50 (in particular, into avicinity of a part connected with the wire connection region 217) andlight absorption caused by the light incidence can be suppressed.Incidentally, this protrusion of the resin molded body 30 is provided ona spaced region between the first lead electrode 10 and the second leadelectrode 20 in the present embodiment, but may be provided unevenly onthe first lead electrode 10 or on the second lead electrode 20.

As shown in FIG. 2A, the wire connection region 217 is preferablypositioned on an extended line of a diagonal line of the element mountregion 213, adjacently to a corner of the element mount region 213 intop view. Thereby, a ratio that an end of the side wall 219 ispositioned on a border of the element mount region 213 can be increasedcomparatively, so that the light emitted from the light-emitting element41 is likely to be reflected by the surface of the side wall 219directly. Moreover, in the case of the light-emitting element 41 havinga rectangular shape in top view, in which at least one of a pair ofpositive and negative electrodes (pad electrodes) is arranged near thecorner, the wire 50 can be formed easily in accordance with sucharrangement. Incidentally, the element mount region 213 is slanted(rotated by about 45° in the present embodiment) with respect to theouter shape of the resin molded body 30 and the opening of the recessportion 210 in top view.

As shown in FIG. 2B, the light-emitting element 41 has a shape that itsupper surface (a substrate surface) (on a substrate side) is smallerthan its lower surface (an element structure surface) (on an elementstructure side) and its side surface is inclined. Thus, light-emittingintensity of the light-emitting element 41 is higher in a slanteddirection than in a direction right above the light-emitting element 41.Then, the light-emitting device 250 has a structure that facilitates toextract the light that is thus emitted in the slanted direction from thelight-emitting element 41 by reflecting the light by the surface of theside wall 219 directly.

As shown in FIG. 2B, the sealing member 60 includes phosphor 80. Then,the phosphor 80 is dispersed substantially entirely in the sealingmember 60. Thereby, coating of the phosphor 80 on the surface of theside wall 219 can be reduced, and the surface of the side wall 219 canbe utilized as a reflection surface comparatively easily. Therefore,even in the case where the sealing member 60 includes the phosphor 80,the light emitted from the light-emitting element 41 can be reflecteddirectly by the surface of the side wall 219 comparatively easily.

Besides, also by distributing the phosphor 80 unevenly near thelight-emitting element 41 in the sealing member 60 or by allowing thelight-emitting element 41 itself to hold the phosphor 80, the coating ofthe phosphor 80 on the surface of the side wall 219 can be reduced, andthe surface of the side wall 219 can be utilized as the reflectionsurface easily.

As stated above, the top-view (top surface light-emitting) type packagehas been described as the embodiments, but a structure of an externalconnection terminal is not limited particularly and a side-view (sidesurface light-emitting) type package can also be adopted, as long as thepackage is provided with the first and second lead electrodes and theresin molded body, and also has the recess portion in which thelight-emitting element is stored.

Hereinafter, the respective constituents of the package and thelight-emitting device of the embodiment of the present invention will bedescribed.

First Lead Electrode 10 and Second Lead Electrode 20

For the lead electrodes, metal members that can electrically conductwhen being connected with the light-emitting element can be used. Morespecifically, copper, aluminum, gold, silver, tungsten, iron, nickel,cobalt, molybdenum, alloy of them, phosphor bronze, copper-iron alloyand the like are exemplified. Shapes of the lead electrodes can beformed by processing board materials of the above-described metal bypressing, rolling, etching or the like. Moreover, on a surface layer ofthe lead electrode, a light reflective layer of silver, aluminum,rhodium, gold, copper, alloy of them or the like may be provided byplating or the like, and among them, silver that has the best lightreflectivity is preferably used.

Resin Molded Body 30

The resin molded body has preferably light reflectivity. Thus, the resinmolded body is preferably colored white. As a base material of the resinmolded body, a thermosetting resin or a thermoplastic resin can be used.As the thermosetting resin, an epoxy resin, a modified epoxy resin, asilicone resin, a modified silicone resin, a polybismaleimide triazineresin, a polyimide resin, a polyurethane resin and the like areexemplified. Among them, any one of an epoxy resin, a modified epoxyresin, a silicone resin and a modified silicone resin is preferablyused. As the thermoplastic resin, an aliphatic polyamide resin, asemi-aromatic polyamide resin, a polyethylene terephthalate, apolycyclohexane terephthalate, a liquid crystal polymer, a polycarbonateresin, syndiotactic polystyrene, polyphenylene ether, polyphenylenesulfide, a polyether sulfone resin, a polyether ketone resin, apolyarylate resin and the like are exemplified. Among them, an aliphaticpolyamide resin or polycyclohexane terephthalate is preferably used.Further, in these base materials, particles or fibers of glass, silica,titanium oxide, magnesium oxide, magnesium carbonate, magnesiumhydroxide, calcium carbonate, calcium hydroxide, calcium silicate,magnesium silicate, wollastonite, mica, zinc oxide, barium titanate,potassium titanate, aluminum borate, aluminum oxide, zinc oxide, siliconcarbide, antimony oxide, zinc stannate, zinc borate, iron oxide,chromium oxide, manganese oxide, carbon black or the like can be mixedas a filler or a coloring pigment. Among them, silica as the filler andtitanium oxide or zinc oxide as the coloring pigment (a reflectingmember) are preferably used.

Light-Emitting Elements 40 and 41

As the light-emitting element, a semiconductor light-emitting elementsuch as a light-emitting diode element can be used. The light-emittingelement may have: an element structure that is composed of various kindsof semiconductors; and a pair of positive and negative electrodes. Inparticular, a light-emitting element of a nitride semiconductor(In_(x)Al_(y)Ga_(1-x-y)N, 0≤x, 0≤y, x+y≤1) which can emit light fromultraviolet light to light in visible range is preferably used. Inaddition, a light-emitting element of a gallium arsenide-based orgallium phosphide-based semiconductor which emits light in green to redmay be used. Many of the light-emitting elements have substrates. Thesubstrate is preferably translucent, but is not limited to this. As abase material of the substrate, sapphire, spinel, gallium nitride,aluminum nitride, silicon, silicon carbide, gallium arsenide, galliumphosphide, indium phosphide, zinc sulfide, zinc oxide, zinc selenide andthe like are exemplified. In the case of the light-emitting element inwhich the pair of the positive and negative electrodes are provided onthe same surface side, the electrodes are connected with the leadelectrodes respectively by wires, and are packaged in a face-up manner.In the case of the light-emitting element with a counter electrodestructure in which the pair of the positive and negative electrodes areprovided respectively on opposing surfaces sides, a lower surfaceelectrode adheres to the lead electrode with an electrical conductiveadhesive, and an upper surface electrode is connected with the leadelectrode by a wire. The number of the light-emitting elements to bemounted on one package may be one or plural. The plural light-emittingelements can be connected in series or in parallel by the wires.Moreover, for example, three light-emitting elements which respectivelyemit light in blue, green and red may be mounted on one package.

Wire 50

The wire is a conducting wire that connects the electrode of thelight-emitting element with the lead electrode. More specifically, ametal wire of gold, copper, silver, platinum, aluminum or alloy of themcan be used. In particular, a gold wire which is not likely to be brokenby stress from the sealing member and has good thermal resistance andthe like is preferably used. Also, in order to enhance the lightreflectivity, at least a surface of the wire may be made of silver.

Sealing Member 60

The sealing member is a member for sealing the light-emitting element,the wire and the like so as to protect them from dust, moisture,external force and the like. A base material of the sealing member mayhave an electrical insulation property, and may be able to transmitlight which is emitted from the light-emitting element and/or thephosphor (preferably at a transmittance of 70% or more). Morespecifically, a silicone resin, an epoxy resin, a phenol resin, apolycarbonate resin, an acrylic resin, a TPX resin, a polynorborneneresin, modified resins of them and a hybrid resin containing one kind ormore of these resins are exemplified. Among them, a silicone resin andits modified resin are preferable, because they have excellent heatresistance and light resistance, and their volumetric shrinkage aftersolidification is small. Further, in the sealing member, particleshaving various functions such as a filler and a phosphor may be mixed inits base material. As the filler, a diffusing agent, a coloring agent orthe like can be used. More specifically, silica, titanium oxide,magnesium oxide, magnesium carbonate, magnesium hydroxide, calciumcarbonate, calcium hydroxide, calcium silicate, zinc oxide, bariumtitanate, aluminum oxide, iron oxide, chromium oxide, manganese oxide,glass, carbon black and the like are exemplified.

Protective Element 70

The protective element is an element for protecting the light-emittingelement from static electricity and a high-voltage surge. Morespecifically, a Zener diode is exemplified.

Phosphor 80

The phosphor absorbs at least part of the primary light that is emittedfrom the light-emitting element, and emits secondary light at awavelength which is different from that of the primary light. Morespecifically, yttrium-aluminum-garnet activated with cerium,nitrogen-containing calcium aluminosilicate activated with europiumand/or chromium, sialon activated with europium, silicate activated witheuropium, potassium fluorosilicate activated with manganese and the likeare exemplified. Accordingly, a light-emitting device which emitsmixed-color light (for example, white light) of primary light andsecondary light at visible wavelengths, or a light-emitting device whichemits secondary light at a visible wavelength by being excited withprimary light that is ultraviolet light can be obtained.

Adhesive

The adhesive is a member for sticking the light-emitting element to thelead electrode. As an insulating adhesive, an epoxy resin, a siliconeresin, a polyimide resin, modified resins of them, hybrid resins of themand the like can be used. As an electrical conductive adhesive, aconductive paste of silver, gold, palladium or the like,tin-bismuth-based, tin-copper-based, tin-silver-based or gold-tin-basedsolder or the like can be used.

EXAMPLES

Hereinafter, examples according to the embodiment of the presentinvention will be described in detail. Needless to say, the presentinvention is not limited only to the examples described below.

Example 1

A light-emitting device of Example 1 is a top-view SMD-type LED with anapproximately rectangular parallelepiped shape, which has the structureof the light-emitting device 150 in the example illustrated in FIGS. 1Band 1C (excluding the protective element 70). Hereinafter, theexplanation will be provided by specifying a length (in a verticaldirection) and a width (in a lateral direction) in accordance with thedirections of the package and the light-emitting device illustrated inFIG. 1B.

The package has a size of a length of 3.0 mm, a width of 3.0 mm and athickness of 0.52 mm, which is structured by molding a resin molded bodyintegrally with a pair of positive and negative (first and second) leadelectrodes. This package is produced by: setting a processing metalboard (a lead frame), which includes a plurality of sets of the leadelectrodes arranged consecutively in rows and columns via suspensionleads, into a mold; injecting a liquid constituent material of the resinmolded body; solidifying the constituent material; releasing theconstituent material with the lead frame from the mold; and subsequentlycutting them (into individual chips).

Each of the first and second lead electrodes is a board-shaped smallchip of copper alloy whose surface is subjected to silver plating andwhose maximum thickness is 0.2 mm. An exposed region of a lower surfaceof each of the first and second electrodes constitutes substantially thesame face as a lower surface of the resin molded body, which constitutesa lower surface of the package. In each of the first and second leadelectrodes, the cut suspension lead portion is exposed from an endsurface of the package (the resin molded body).

The resin molded body has an outer shape of a foursquare with a lengthof 3.0 mm and a width of 3.0 mm in top view, and has a maximum thicknessof 0.52 mm, which is made of an epoxy resin that contains silica andtitanium oxide. At a substantial center of an upper surface of the resinmolded body, that is, an upper surface of the package, a recess portion,which has a round-cornered foursquare opening with a length of 2.6 mmand a width of 2.6 mm (excluding a notch for polarity identification) intop view, and whose depth is 0.32 mm, is formed.

The recess portion is constituted by a bottom portion and a side wall.An element mount region of the (round-cornered) bottom portion is in anexposed region of an upper surface of the first lead electrode (aposition of the element mount region is at a center in the verticaldirection, and at a right end in the lateral direction), and is anapproximately foursquare region with a length of 840 μM and a width of840 μm. A second wire connection region is in the exposed region of theupper surface of the first lead electrode (the second wire connectionregion is positioned continuously to the element mount region on itsleft side so that lower sides of the second wire connection region andthe element mount region may be on the same straight line), and is asubstantially rectangular region with a length of 420 μm and a width of310 μm. A first wire connection region is in an exposed region of anupper surface of the second lead electrode (the first wire connectionregion is positioned, in the vertical direction, so that upper sides ofthe first wire connection region and the element mount region may be onthe same straight line, and is positioned at a left end in the lateraldirection), and is a substantially rectangular region with a length of420 m and a width of 230 μm. Between the element mount region and thefirst wire connection region of the bottom portion, there is a spacedregion of the first lead electrode and the second lead electrode, whichis structured by a surface of the resin molded body. A surface of theside wall is structured by the resin molded body, and is inclined from aperiphery of the bottom portion as a substantial starting point (anend). An inclination angle θ of the surface of the side wall ranges from18° to 33°.

On the element mount region of the package, one light-emitting elementadheres with an adhesive that is a dimethyl silicone resin. Thislight-emitting element is an LED element with a length of 650 pan, awidth of 650 μm and a thickness of 150 m, in which an element structureof a nitride semiconductor is laminated on a sapphire substrate, andwhich can emit blue light (at a center wavelength of about 453 nm).Further, an n electrode of the light-emitting element is connected tothe second wire connection region by a wire, and a p electrode of thelight-emitting element is connected to the first wire connection regionby a wire. The wires are gold wires with a wire diameter of 25 μm.

The recess portion of the package is filled with a sealing member, bywhich the light-emitting element is coated. The sealing member includesa phenyl silicone resin as a base material, in which a filler of silicais contained. An upper surface of the sealing member constitutessubstantially the same face as the upper surface of the package, and issubstantially a flat surface (in a precise sense, a slightly concaveface due to cure shrinkage). This sealing member is formed by: droppingits liquid constituent material into the recess portion of the packagewith a dispenser or the like; and solidifying the constituent materialby heat.

The light-emitting device of Example 1 which is structured as describedabove can emit light at a current of 65 mA and radiant flux (Φ_(e)) of117.1 mW. This value is higher, by as much as 8.7%, than 107.8 mW thatis radiant flux (Φ_(e)) of a light-emitting device which is producedsimilarly to the light-emitting device of Example 1 except for providinga recess portion having: an opening with the same top-view shape; and asurface of a side wall that is inclined uniformly at an inclinationangle (θ) of 63°.

A package of the embodiment of the present invention includes: a firstlead electrode; a second lead electrode; and a resin molded body that ismolded integrally with the first lead electrode and the second leadelectrode, and has a recess portion in which a light-emitting element isto be stored, wherein the recess portion is constituted by a bottomportion and a side wall, the bottom portion includes: an element mountregion in which an upper surface of the first lead electrode is exposedfrom the resin molded body; and a wire connection region in which anupper surface of the second lead electrode is exposed from the resinmolded body, the element mount region has a top-view shape that issubstantially along an outer shape of the light-emitting element, thewire connection region is adjacent to the element mount region and issmaller than the element mount region, and a surface of the side wall isinclined or curved so that an opening diameter of the recess portionbecomes larger toward an upward direction from the element mount regionand the wire connection region.

According to the embodiment of the present invention, repeated lightreflection by inner surfaces of the package can be suppressed, so thatthe light from the light-emitting element can be extracted efficiently.

Obviously, numerous modifications and variations of the presentinvention are possible in light of the above teachings. It is thereforeto be understood that within the scope of the appended claims, theinvention may be practiced otherwise than as specifically describedherein.

What is claimed is:
 1. A package comprising: a resin molded body havinga first side, a second side opposite to the first side in a heightdirection of the resin molded body, and a side wall provided between thefirst side and the second side to surround a recess portion which has abottom portion on the second side and an opening on the first side andin which a light-emitting element is to be provided; a first leadelectrode provided on the second side of the resin molded body; a secondlead electrode provided on the second side of the resin molded body; andthe bottom portion of the recess portion comprising: an element mountregion in which an upper surface of the first lead electrode is exposedfrom the resin molded body and which has a polygonal outer peripheralshape having corners and diagonals connecting two of the corners whenviewed in the height direction, the element mount region being providedin a vicinity of the side wall; and a wire connection region in which anupper surface of the second lead electrode is exposed from the resinmolded body, the wire connection region being separated from the elementmount region by a part of the resin molded body of which a height ishigher than that of the upper surface of the first lead electrode, anarea of the wire connection region being smaller than an area of theelement mount region when viewed in the height direction, the wireconnection region being provided on an extension of one of the diagonalspassing through one of the corners of the element mount region to facetoward the one of the corners, wherein a shape of the element mountregion is a rectangle when viewed in the height direction.
 2. Thepackage according to claim 1, wherein an outer periphery of the resinmolded body has substantially a rectangular shape having firstrectangular sides when viewed in the height direction, wherein theopening has substantially a rectangular shape having second rectangularsides when viewed in the height direction, wherein the polygonal outerperipheral shape has third sides connecting corners, and wherein each ofthe third sides is non-parallel to each of the first rectangular sidesand non-parallel to each of the second rectangular sides when viewed inthe height direction.
 3. A light-emitting device comprising: the packageaccording to claim 1; and a light-emitting element mounted on theelement mount region in the recess portion.
 4. The light-emitting deviceaccording to claim 3, wherein the area of the element mount region is1.5 times or less of an area of the light-emitting element.
 5. Thelight-emitting device according to claim 3, wherein the light emittingelement includes a substrate surface, an element structure surfaceopposite to the substrate surface in the height direction, and a lightemitting element side surface connecting the substrate surface and theelement structure surface, wherein the substrate surface is smaller thanthe element structure surface, wherein the light emitting element ismounted on the element mount region such that the element structuresurface of the light emitting element faces the element mount region ofthe bottom portion and the light emitting element side surface isnon-parallel to the height direction.
 6. The light-emitting deviceaccording to claim 3, further comprising: a sealing member provided inthe recess portion to seal the light-emitting element, the sealingmember including phosphor dispersed in the sealing member.
 7. Thepackage according to claim 1, wherein the element mount region is aregion in which the upper surface of the first lead electrode is exposedfrom the side wall of the resin molded body, and wherein the wireconnection region is a region in which the upper surface of the secondlead electrode is exposed from the side wall of the resin molded body.8. A package comprising: a resin molded body having a first side, asecond side opposite to the first side in a height direction of theresin molded body, and a side wall provided between the first side andthe second side to surround a recess portion which has a bottom portionon the second side and an opening on the first side and in which alight-emitting element is to be provided; a first lead electrodeprovided on the second side of the resin molded body; a second leadelectrode provided on the second side of the resin molded body; and thebottom portion of the recess portion comprising: an element mount regionin which an upper surface of the first lead electrode is exposed fromthe resin molded body and which has a polygonal outer peripheral shapehaving corners and diagonals connecting two of the corners when viewedin the height direction, the element mount region being provided in avicinity of the side wall; and a wire connection region in which anupper surface of the second lead electrode is exposed from the resinmolded body, the wire connection region being separated from the elementmount region by a part of the resin molded body of which a height ishigher than that of the upper surface of the first lead electrode, anarea of the wire connection region being smaller than an area of theelement mount region when viewed in the height direction, the wireconnection region being provided on an extension of one of the diagonalspassing through one of the corners of the element mount region to facetoward the one of the corners, wherein a shape of the upper surface ofthe first lead which is exposed from the resin molded body is arectangle when viewed in the height direction.
 9. A package comprising:a resin molded body having a first side, a second side opposite to thefirst side in a height direction of the resin molded body, and a sidewall provided between the first side and the second side to surround arecess portion which has a bottom portion on the second side and anopening on the first side and in which a light-emitting element is to beprovided; a first lead electrode provided on the second side of theresin molded body; a second lead electrode provided on the second sideof the resin molded body; and the bottom portion of the recess portioncomprising: an element mount region in which an upper surface of thefirst lead electrode is exposed from the resin molded body and which hasa polygonal outer peripheral shape having corners and diagonalsconnecting two of the corners when viewed in the height direction, theelement mount region being provided in a vicinity of the side wall; anda wire connection region in which an upper surface of the second leadelectrode is exposed from the resin molded body, the wire connectionregion being separated from the element mount region, an area of thewire connection region being smaller than an area of the element mountregion when viewed in the height direction, the wire connection regionbeing provided on an extension of one of the diagonals passing throughone of the corners of the element mount region to face toward the one ofthe corners, wherein a shape of the upper surface of the first leadwhich is exposed from the resin molded body is a rectangle when viewedin the height direction.
 10. The package according to claim 9, whereinan outer periphery of the resin molded body has substantially arectangular shape having first rectangular sides when viewed in theheight direction, wherein the opening has substantially a rectangularshape having second rectangular sides when viewed in the heightdirection, wherein the polygonal outer peripheral shape has third sidesconnecting corners, and wherein each of the third sides is non-parallelto each of the first rectangular sides and non-parallel to each of thesecond rectangular sides when viewed in the height direction.
 11. Alight-emitting device comprising: the package according to claim 9; anda light-emitting element mounted on the element mount region in therecess portion.
 12. The light-emitting device according to claim 11,wherein the area of the element mount region is 1.5 times or less of anarea of the light-emitting element.
 13. The light-emitting deviceaccording to claim 11, wherein the light emitting element includes asubstrate surface, an element structure surface opposite to thesubstrate surface in the height direction, and a light emitting elementside surface connecting the substrate surface and the element structuresurface, wherein the substrate surface is smaller than the elementstructure surface, wherein the light emitting element is mounted on theelement mount region such that the element structure surface of thelight emitting element faces the element mount region of the bottomportion and the light emitting element side surface is non-parallel tothe height direction.
 14. The light-emitting device according to claim11, further comprising: a sealing member provided in the recess portionto seal the light-emitting element, the sealing member includingphosphor dispersed in the sealing member.
 15. The light-emitting deviceaccording to claim 9, wherein the wire connection region is separatedfrom the element mount region by a part of the resin molded body ofwhich a height is higher than that of the upper surface of the firstlead electrode.
 16. The package according to claim 9, wherein theelement mount region is a region in which the upper surface of the firstlead electrode is exposed from the side wall of the resin molded body,and wherein the wire connection region is a region in which the uppersurface of the second lead electrode is exposed from the side wall ofthe resin molded body.